YLPP 10-20 ps 100 W

YLPP 1-3 ps, 10-50 W

Ytterbium Picosecond Pulsed Laser

IPG’s new YLPP-25-3-50 Ultra Short Pulse fiber laser produces sub 3 ps pulses with 25 μJ pulse energy delivered across its entire operational frequency range from 50 kHz to 2 MHz, producing up to 50 W of average power and extremely high peak powers up to 10 MW. Our monolithic-all-spliced-fiber design is “beyond state-of-the-art” enabling an incredibly compact laser that’s inherently more power efficient, reliable and robust than conventional bulk-rod or disk based DPSS USP lasers yet priced significantly lower than the industries legacy products. The novel design architecture together with our flexible control electronics provides conveniently short warm-up times and allows adjustment of both pulse energy and repetition rate without affecting the output beam parameters.

3D

Features

Ultra-Compact, 1.5 kg Laser Head Warm Start in Seconds
Broad Frequency of Operation 50 kHz to 2 MHz Cold Start in <1 minute
Pulse width <3 psec, typically 2 psec Wall-plug Efficiency >15%
Pulse Energy 25 μJ from 50 kHz to 2 MHz Integrated Delivery Fiber to Remote Head
Power 50 W Average, 10 MW Peak Integrated Scanner Option

 

Laser pulses with durations of just a few picoseconds create peak intensities so high that non-linear/multiphoton absorption takes place, resulting in an ultra-precise “cold” process with very small heat affect - making them ideal for applications in micromachining, surface structuring, thin film ablation, thin foil or polymer cutting, dark marking of metals and processing of brittle or transparent materials. 

 

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YLPP-25-3-50-R

Wavelength, nm 1030
Mode of Operation Pulsed
Average Power, W 50
Pulse Energy, μJ 25
Pulse Duration, ps 1-3 (2 ps typical)
Peak Power, MW up to 10
Repetition Rate, kHz 50-2000
Beam Quality, M2 < 1.4 (1.2 typical)
  YLPP-25-3-50-R
Control Unit Dimensions, mm 448 × 580 × 133
Optical Head Dimensions, mm 65 × 216 × 70
Cooling Water
Supply Voltage, Single-phase 50-60 Hz, VAC  100-240
Power Consumption, W <300
YLPP-25-3-50-R Datasheet

Applications

Precision Micromachining Sapphire LED Wafer Scribing 
Black Marking of Stainless Steel or Al Thin Film Ablation for Solar/PV/FPD
Surface Micro-structuring & Texturing Cutting and Drilling Glass/Sapphire
Multilayer Polymer Film Cutting Precise Marking of Metals/Polymers/Glass 
Battery and Thin Metal Foil Cutting Micromachining of Ceramics

 

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Precision Micromachining

Fine features can be machined in a broad range of materials using Ultra-Short Pulsed lasers with sub 10 picosecond pulse durations.

Black Marking of Metals for Consumer Electronics & Medical Devices

Short picosecond pulses are ideal for creating high contrast “black” marks or barcodes on metals such as stainless steel and aluminum. Due to the ultrashort pulse lengths these marks are non-thermal in nature, and therefore more resistant to corrosion or fading during extended use or after repeated cleaning or autoclaving making them ideal for unique identifier marks on surgical or medical devices.

 

black marking of metals

  black marking of metals, qr code  

 

Sapphire LED Wafer Scribing and Dicing

Sapphire wafers used as the substrate material for high brightness LEDs can be scribed using picosecond lasers. The images below show grooves machined in sapphire on edge of wafer to show profile and depth (using YLPP psec laser.) 

 

sapphire LED wafer scribing and dicing

  sapphire LED wafer scribing and dicing  

 

Thin Film Ablation for Solar/PV/FPD

Short picosecond lasers are ideal for ablating the thin conductive oxide, anti-reflection /nitride or metal films used in thin film or silicon solar cells.

 

 

     

 

Surface Micro-structuring & Texturing

YLPP picosecond and femtosecond lasers are ideal for creating microstructures on the surface of metals and various alloys. These micro structures can be in the form of trenches, ridges, posts or dimples according to the pitch spot size and scanning patterns of ablation. Below are two examples of micro-structured patterns in a Platinum Iridium alloy sample that were ablated using IPG’s YLPF 10uJ/pulse sub 500 femtosecond pulse width laser.

Micro-structuring of Posts & Lines in Platinum Iridium samples, using YLPF fs laser.

 

Surface Micro-structuring & Texturing

  Surface Micro-structuring & Texturing  

 

Polymer and Thermoplastic Film Cutting

Precise cutting and feature patterning of polymer films with exceptional edge quality, repeatability and accuracy can be done using YLPF femtosecond lasers. The images above show a 380 micron diameter circular and rectangular cuts in a polyimide film.

 

polymer and thermoplastic film cutting

  polymer and thermoplastic film cutting  

 

Battery and Thin Metal Foil Cutting 

YLPP picosecond and femtosecond Lasers are ideal for cutting thin metal foils such as those used in the manufacturing of batteries. The two images above show side view and cross sections of a PdAgCu thin metal foil cut with excellent edge quality using a YLPF femtosecond laser. 

 

battery and thin metal foil cutting

  battery and thin metal foil cutting  

 

Precise Marking of Glass, Sapphire and Ceramics 

High contrast “white” surface marks with good readability can be made on Glass or Sapphire surfaces using short picosecond pulses from IPG’s YLPP laser. These surface marks have no noticeable micro cracking which could compromise the substrate integrity. 

    precise laser marking of glass

 

Micromachining of Ceramic, Sapphire and Glass

YLPF femtosecond lasers are ideal for fast machining of very precise features in brittle materials such as sapphire or glass. The images above show 70 micron deep pocket trenches milled in sapphire with the YLPF laser. Process time was 8.5 seconds for a 1.2mm square feature.

 

Micromachining of Ceramic, Sapphire and Glass

  Micromachining of Ceramic, Sapphire and Glass  

 Ultra Short Pulse Materials Processing

 

how does an ultra fast laser work?

 

  • "Cold process" reduced melt and HAZ, less recast metal
  • Fewer micro-cracks and better ablated surface quality
  • Absorption is less material/wavelength dependent

Advantages of YLPP & YLPF Lasers

 

Disadvantages of Traditional Ultrafast Lasers

Advantages of YLPP and YLPF Lasers

High initial acquisition cost, running cost and expensive maintenance costs

Truly enabling price point

Low throughput speed due to limited pulse energies at high rep rates

Repetition rates out to 2 MHz without fall off in pulse energy → boosts throughput

Complex free space “scientific” optical designs are sensitive to misalignment, contamination and environmental effects → Poor reliability and robustness

Monolithic all-spliced-fiber design is less sensitive to misalignment, contamination and environmental changes in temperature/humidity/vibration and therefore inherently more reliable and compact. 

Bulky size and weight

Ultra-compact head is approx. 1/20th the size and 1/30th the weight of competitors' lasers

Difficult to integrate into tools due to no fiber delivery/output 

Rack mountable Power Supply and Remote Compact Laser head with fiber delivery is easy to integrate

Long warm up times

Warms up in seconds

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