YLPP-25-1-50-R ultrashort pulse fiber laser provides pulses with 25 μJ pulse energy with scalable average output power of 50 W and customer selected pulse durations in the range of 1 to 5 ps at full operational repetition rate range of 50-5500 kHz. Our monolithic-all-spliced-fiber design is “beyond state-of-the-art”, enabling an incredibly compact laser that is inherently more power efficient, reliable and robust than conventional bulk-rod or disk based DPSS USP lasers yet priced significantly lower than legacy products. The novel design architecture and flexible control electronics provide conveniently short warm-up times and allow adjustment of both pulse energy and repetition rate without affecting the output beam parameters.
Ultra-Compact and Light Laser Head | Burst Mode Option |
Broad Frequency of Operation 50 kHz to 5.5 MHz | Warm Start in Seconds |
Pulse Duration Options 1-5 ps | Cold Start in Seconds |
Pulse Energy 25 μJ | Integrated Delivery Fiber to Remote Head |
Average Power 50 W | Integrated Scanner Option |
Customer can select models within specified maximum power, maximum pulse energy and pulse durations in 1 to 5 ps range. Shorter pulsed durations and higher pulse energies are available upon request.
YLPP-25-1-50-R |
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Wavelength, nm | 1030 | ||||
Mode of Operation | Pulsed | ||||
Average Power, W | 50 | ||||
Pulse Energy, μJ | 25 | ||||
Pulse Duration, ps | 1-5 | ||||
Repetition Rate, kHz | 50-5500 | ||||
Beam Quality, M2 | < 1.4 (1.2 typical) |
YLPP-25-1-50-R | |
Control Unit Dimensions, mm | 448 × 580 × 132 |
Optical Head Dimensions, mm | 65 × 370 × 70 |
Cooling | Water |
Supply Voltage, Single-phase 50-60 Hz, VAC | 100-240 |
Power Consumption, W | <300 |
Precision Micromachining | Sapphire LED Wafer Scribing |
Black Marking of Stainless Steel or Aluminum | Thin Film Ablation for Solar/PV/Flat Panel Display |
Surface Microstructuring & Texturing | Cutting and Drilling Glass/Sapphire |
Multilayer Polymer Film Cutting | Precise Marking of Metals/Polymers/Glass |
Battery and Thin Metal Foil Cutting | Micromachining of Ceramics |
Laser pulses with durations of just a few picoseconds create peak intensities so high that non-linear/multiphoton absorption takes place, resulting in an ultra-precise “cold” process with very small heat affect - making them ideal for applications in micromachining, surface structuring, thin film ablation, thin foil or polymer cutting, dark marking of metals and processing of brittle or transparent materials.
Fine features can be machined in a broad range of materials using Ultra-Short Pulsed lasers with sub 10 picosecond pulse durations.
Black Marking of Metals for Consumer Electronics & Medical DevicesShort picosecond pulses are ideal for creating high contrast “black” marks or barcodes on metals such as stainless steel and aluminum. Due to the ultrashort pulse lengths these marks are non-thermal in nature, and therefore more resistant to corrosion or fading during extended use or after repeated cleaning or autoclaving making them ideal for unique identifier marks on surgical or medical devices. |
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Sapphire LED Wafer Scribing and DicingSapphire wafers used as the substrate material for high brightness LEDs can be scribed using picosecond lasers. The images below show grooves machined in sapphire on edge of wafer to show profile and depth (using YLPP psec laser.) |
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Thin Film Ablation for Solar/PV/FPDShort picosecond lasers are ideal for ablating the thin conductive oxide, anti-reflection /nitride or metal films used in thin film or silicon solar cells. |
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Surface Micro-structuring & TexturingYLPP picosecond and femtosecond lasers are ideal for creating microstructures on the surface of metals and various alloys. These micro structures can be in the form of trenches, ridges, posts or dimples according to the pitch spot size and scanning patterns of ablation. Below are two examples of micro-structured patterns in a Platinum Iridium alloy sample that were ablated using IPG’s YLPF 10uJ/pulse sub 500 femtosecond pulse width laser. Micro-structuring of Posts & Lines in Platinum Iridium samples, using YLPF fs laser. |
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Polymer and Thermoplastic Film CuttingPrecise cutting and feature patterning of polymer films with exceptional edge quality, repeatability and accuracy can be done using YLPF femtosecond lasers. The images above show a 380 micron diameter circular and rectangular cuts in a polyimide film. |
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Battery and Thin Metal Foil CuttingYLPP picosecond and femtosecond Lasers are ideal for cutting thin metal foils such as those used in the manufacturing of batteries. The two images above show side view and cross sections of a PdAgCu thin metal foil cut with excellent edge quality using a YLPF femtosecond laser. |
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Precise Marking of Glass, Sapphire and CeramicsHigh contrast “white” surface marks with good readability can be made on Glass or Sapphire surfaces using short picosecond pulses from IPG’s YLPP laser. These surface marks have no noticeable micro cracking which could compromise the substrate integrity. |
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Micromachining of Ceramic, Sapphire and GlassYLPF femtosecond lasers are ideal for fast machining of very precise features in brittle materials such as sapphire or glass. The images above show 70 micron deep pocket trenches milled in sapphire with the YLPF laser. Process time was 8.5 seconds for a 1.2mm square feature. |
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Disadvantages of Traditional Ultrafast Lasers |
Advantages of YLPP and YLPF Lasers |
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High initial acquisition cost, running cost and expensive maintenance costs |
Truly enabling price point |
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Low throughput speed due to limited pulse energies at high rep rates |
Repetition rates out to 2 MHz without fall off in pulse energy → boosts throughput |
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Complex free space “scientific” optical designs are sensitive to misalignment, contamination and environmental effects → Poor reliability and robustness |
Monolithic all-spliced-fiber design is less sensitive to misalignment, contamination and environmental changes in temperature/humidity/vibration and therefore inherently more reliable and compact. |
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Bulky size and weight |
Ultra-compact head is approx. 1/20th the size and 1/30th the weight of competitors' lasers |
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Difficult to integrate into tools due to no fiber delivery/output |
Rack mountable Power Supply and Remote Compact Laser head with fiber delivery is easy to integrate |
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Long warm up times |
Warms up in seconds |