Micro-drilling applications include both through holes and blind holes, and can demand vertical sidewalls or tapered sidewalls, depending on the application. Hole diameters can be down to 2 microns, with sub-micron placement accuracy. Drilling rates up to 1,000 holes per second are available.
Each material has unique challenges, from thermal affectation to laser coupling. IPG’s range of laser types and beam delivery technologies allow optimization for each application, and can be implemented as high-speed fully-automated manufacturing solutions.
|
|
There is an increased interest on the laser fabrication of variable shape and small size features (<100 microns), with controlled or zero taper, on a large variety of materials, and covering a large range of thicknesses up to several millimeters. The quality and throughput requirements continue to increase, with tighter tolerances regarding dimensional and positional specs. Consequently, improved manufacturing techniques, with advanced process control and laser sources, need to be developed to be able to address ever increasing industry requirements.
|