Laser Lift-off
Laser Lift Off (LLO) is a technique to selectively remove
one material from another. It utilizes a process whereby
the laser passes through a transparent base material
and couples strongly with a second material. LLO
is widely used in LED manufacturing to separate
the GaN semiconductor from the Sapphire host
wafer, and has application in other processes
that involve transparent and absorbing films,
such as the separation of polymers from
glass in flex display and AMOLED
applications.