Cutting and Scribing

IPG’s Cutting and Scribing Systems combine world-leading

fiber lasers with beam/part positioning and software,

offering highly productive tools for cutting and scribing

parts made of metals, ceramics, semiconductors,

sapphire, silicone, polymers and many other materials.

Standard IPG systems accommodate part/substrate

sizes from a few millimeters up to 1.2 x 1.2 m.

IPG will optimize selection of laser type and

beam delivery design for each application. 

Custom configurations of each tool

are available. User can select

automation options from manual

load to fully-automated platforms

suited for 24/7 production.

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