Heat Treating and Annealing

IPG’s laser systems are used in the microelectronics industry

for high-speed heat treatment of semiconductor wafers

for dopant activation, ohmic contact formation or

surface recrystallization.

Selective Laser Annealing system uses high-speed

scanning of a small beam to provide highly

localized selective annealing of heat-sensitive

materials. 

The wavelength choice is determined by material’s

optical properties, and pulse duration is

adjusted to achieve the desired heat

penetration depth. Please contact IPG

regarding initial parameterization work

to identify the best solution for your needs.

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