YLPP 10-20 ps 100 W

YLPP-R Series

Ytterbium Picosecond Pulsed Laser

IPG’s new YLPP-25-3-50-R Ultra Short Pulse fiber laser produces sub 3 ps pulses with 25 μJ pulse energy delivered across its entire operational frequency range from 50 kHz to 2 MHz, producing up to 50 W of average power and extremely high peak powers up to 10 MW. Our monolithic-all-spliced-fiber design is “beyond state-of-the-art” enabling an incredibly compact laser that’s inherently more power efficient, reliable and robust than conventional bulk-rod or disk based DPSS USP lasers yet priced significantly lower than the industries legacy products. The novel design architecture together with our flexible control electronics provides conveniently short warm-up times and allows adjustment of both pulse energy and repetition rate without affecting the output beam parameters.

3D

Features

Ultra-Compact, 1.5 kg Laser Head Warm Start in Seconds
Broad Frequency of Operation 50 kHz to 2 MHz Cold Start in <1 minute
Pulsewidth <3 psec, typically 2 psec Wall-plug Efficiency >15%
Pulse Energy 25 μJ from 50 kHz to 2 MHz Integrated Delivery Fiber to Remote Head
Power 50 W Average, 10 MW Peak Integrated Scanner Option

 

Laser pulses with durations of just a few picoseconds create peak intensities so high that non-linear/multiphoton absorption takes place, resulting in an ultra-precise “cold” process with very small heat affect - making them ideal for applications in micromachining, surface structuring, thin film ablation, thin foil or polymer cutting, dark marking of metals and processing of brittle or transparent materials. 

 

YLPP-25-3-50-R

Wavelength, nm 1030
Mode of Operation Pulsed
Average Power, W 50
Pulse Energy, μJ 25
Pulse Duration, ps 1-3 (2 ps typical)
Peak Power, MW up to 10
Repetition Rate, kHz 50-2000
Beam Quality, M2 < 1.4 (1.2 typical)
  YLPP-25-3-50-R
Control Unit Dimensions, mm 448 × 580 × 132
Optical Head Dimensions, mm 65 × 216 × 70
Cooling Water
Supply Voltage, Single-phase 50-60 Hz, VAC  100-240
Power Consumption, W <300
YLPP-R Series Datasheet

Applications

Precision Micromachining Sapphire LED Wafer Scribing 
Black Marking of Stainless Steel or Al Thin Film Ablation for Solar/PV/FPD
Surface Micro-structuring & Texturing Cutting and Drilling Glass/Sapphire
Multilayer Polymer Film Cutting Precise Marking of Metals/Polymers/Glass 
Battery and Thin Metal Foil Cutting Micromachining of Ceramics

 Ultra Short Pulse Materials Processing

Ultra short pulse laser with small or no HAZ Nanosecond laser with large HAZ

  • "Cold process" reduced melt and HAZ, less recast metal
  • Fewer micro-cracks and better ablated surface quality
  • Absorbtion is less material/wavelength dependent

Black Marking

Subsurface corrosion resistant black marking of polished stainless steel.

  black marking QR code

 


 

contrast laser marking on wire  

Marking & Drilling

Good contrast on marking the Pebax. No thermal damage to the wire. Holes cut - minimal damage to the surrounding area.


Cutting

Cut coated AI foils. Battery application for medical device components.

  cutting of thin coated AI foils
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