Laser scribing is a partial cut usually followed by breaking.
Scribing is differentiated from dicing, which is a full cut,
typically on tape.
Typical considerations in LED and device
scribing applications are the accuracy of
the groove placement, minimal heat
affect zone (HAZ), narrowest kerf
width possible (down to 2.5 µm)
to allow more usable die per
wafer, and the maximum
processing speeds possible
for the highest throughput.