材料除去

Selective material removal refers to using lasers to remove only

one type or area of a material from a complex part, while

leaving the remainder undamaged. Selectivity can be

achieved by energy-dependent depth control, wavelength-

dependent material interactions and spatial selectivity.

Micro Material Removal products include Laser Lift Off

systems used in the LED manufacturing industry for

 sapphire wafer separation, and UV ablation tools

used for microelectronic circuit patterning.

Ablative coating removal refers to fully automated

higher power systems used for paint stripping,

laser rust removal, mold cleaning and pre-weld

surface reparation and cleaning.