熱処理・アニーリング
IPG’s laser systems are used in the microelectronics industry
for high-speed heat treatment of semiconductor wafers
for dopant activation, ohmic contact formation or
surface recrystallization.
Selective Laser Annealing system uses high-speed
scanning of a small beam to provide highly
localized selective annealing of heat-sensitive
materials.
The wavelength choice is determined by material’s
optical properties, and pulse duration is
adjusted to achieve the desired heat
penetration depth. Please contact IPG
regarding initial parameterization work
to identify the best solution for your needs.