Mikro-Materialabtragssysteme werden sowohl für Laser Lift Off (LLO) als auch mit UV-Lasertechnik angeboten. LLO Systeme nutzen die Differenz der Bandlückenenergie zwischen GaN Halbleiter Filmstack und Saphir-Materialien, um die Saphir-Wafer in den LEDs zu entfernen. UV Ablationssysteme entfernen direkt herkömmliche Beschichtungen und Isolationsschichten oder schaffen leitende Oberflächen auf elektrischen Teilen.
Beide Systemarten bieten präzise Kontrolle des Laserstrahls und der Energieparameter und liefern sehr hohe Genauigkeit bei der Strahlpositionierung. Alle Systeme können für manuelles Beladen oder vollautomatischen Produktionsbetrieb konfiguriert werden.
| IX-255-LLOIPG Microsystems’ IX-255-LLO is a highly flexible UV laser micromachining system used by the LED manufacturing industry for the separation of sapphire carriers from the GaN active devices. The IX-255-LLO is a manual load system for wafers up to a maximum diameter of 150 mm. | ||
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The system combines a Class 1 workstation integrated with a proprietary UV laser, tool shape selector and software for complex automation sequences. The system can be configured with 193 or 248 nm lasers, and beam delivery configurations are available for high fluence, medium fluence and low fluence process applications. Optional on-target and mask plane beam profilometry can be added for enhanced process QA control. The same LLO capabilities are available in the IX-280-ML, a similar platform that can be configured with two different laser types allowing successive different machining functions to be performed in the same system, eliminating a part-handling and alignment process. |
| Beam Size Selectable up to 500 × 500 μm | |
| Independent Process and Alignment Cameras for Sub-micron Part Alignment Capability | |
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248 or 193 nm Laser Options Available |
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High Precision XY Air Bearing Part Handling Stages |
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| Profilometer and Pulse Energy Monitor Options for Extended QA Logging |
| Motion Control Electronics | Up to 8-axes of Servo or Step Motor Control, integrated into single interface for all motorized components as well as the laser fire mechanism |
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Air-bearing X-Y Part Positioning Stage |
Linear Glass Scale Encoders; Linear Motor Servo Drive System |
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X-Y Stage Specifications |
Travel: Up to 125 mm diameter processing area |
| Z-theta Wafer Alignment Stage | Servomotor Drive System for both Z- and Theta-axes |
| Z-axis Specifications |
Travel: 10.0 mm |
| Theta-axis Specifications |
Travel: ±175° |
| Video Microscope System |
MicroTech Camera Assembly |
| Extended Field Size | Beam Homogenizer Providing Controlled Beam Energy Uniformity over Larger Field Size; Optimized for >2x system throughput in Lower-fluence Applications |
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Programmable Rectangular Variable Aperture |
Enabling Continuously Adjustable Size of Rectangular Shaped Beams |
| Stage Options | Air-bearing X-Y Stage Upgrade, Spindle Stage, Mask Positioner |
| Wavelength Conversion Kits | Laser Wavelength Conversion (Requires IPG Service Engineer Support) |
| Optional Components | Beam Profilometers, Pulse-to-pulse Energy Monitor, System Logging Capabilities, Power Conditioning Units |
| IX-6600 The IX-6655-LLO is optimized for Laser Lift-Off (LLO) processes that are independent of die size, with additional capability for multi-purpose UV laser micromachining. The system combines a Class-1 workstation with an externally mounted laser, select grade homogenizer optics to provide uniform beam size adjustable to 500 x 500 μm, dual beam profilometry, pulse-to-pulse energy monitor with data logging and wafer map. | ||
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The IX-6655-LLO is designed for demanding 24/7 high volume production applications. Featuring optional automation with cassette load/unload ports, robotics, wafer pre-aligner, and machine vision the system is capable of multiple wafer sizes up to 200 mm. The laser system provides high throughput with the lowest Cost Of Ownership resulting from extended lifetimes and cleaning intervals. The same LLO capabilities are available in the IX-280-ML, a similar platform that can be configured with two different laser types allowing successive different machining functions to be performed in the same system, eliminating a part-handling and alignment process. |
| Beam Size Selectable up to 500 × 500 μm | |
| Independent Process and Alignment Cameras for Sub-micron Part Alignment Capability | |
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248 or 193 nm Laser Options Available |
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High Precision XY Air Bearing Part Handling Stages |
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| Profilometer and Pulse Energy Monitor Options for Extended QA Logging | |
| Optional Robotic Wafer Loader for Fully Automated Operation |
| Frame and Enclosure | Fully enclosed Class 1 laser system, heavy duty weldment frame with integrated beam delivery system and control electronics in a 1.7 m x 2 m footprint with an externally mounted laser (included in foot print). |
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Beam Delivery System |
All Granite Beam Delivery Support Structure; Vibration isolating mounting platform for wafer stages and beam delivery optics; Siffness and large thermal mass of granite structure prevent changes in beam delivery system alignment over time; Pnuematic, 2 position laser beam stop; Precision optic mounts for stability and ease of adjustment; select grade UV Homogenizer optics. |
| Motion Control Electronics | Up to 12-axes of Servo or Step Motor Control, integrated into a single interface for all motorized components as well as the laser fire mechanism |
Part Handling
| X-Y Stage Specifications | Travel: Up to 200 mm diameter processing area Optional Stages: Compatible up to 300mm wafer processing Resolution: 0.1 µm Accuracy: <3 µm over 125 mm x 125 mm area Repeatability: <1 µm (bidirectional) |
| Z-axis Specifications | Travel: 10 mm Resolution: 0.25 µm Accuracy: 5.0 µm Repeatability: 1.5 µm (bidirectional) |
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Theta-axis Specifications |
Travel: ±175 ° Resolution: 3.6 µrad Accuracy: 300 µrad overall. 25 µrad/per ° Repeatabiility: ±5.0 µrad |
| Programmable Rectangular Variable Aperture | Enabling continuously adjustable size of rectangular shaped beam. Standard Openining: 0-15mm |
Vision System and Alignment
| Dual Camera | MicroTech Vision System with 8.3 and 0.12 µm/pixel process and inspection cameras |
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Programmable Illumination |
Programmable lighting intensity control for automated optimization of imaging and alignment |
Optional Equipment
| Automated Cassette Load/Unload System | Sapphire Picker |
| Wafer Pre-aligner Features Vision System | Dual Beam Profilometry |
| Database Connectivity Software | On-Target Power Meter |
| Laser Calibration Power Meter/Beam Stop | Pulse Energy Monitor |
| Debris Management System | Motorized Mask Changer |
| Lathe Stage | |
| IX-255The IX-255 is a versatile multi-application laser micromachining tool used for selective material removal, patterning and machining. | ||
| Available with either 193 nm or 248 nm laser sources, these systems deliver on-part beam energy exceeding 25 J/cm2 to provide machining of glass, metals, polymers and ceramics. User-definable beam sizes up to 500 μm, with uniform energy density profiles can be used for large-area material removal or complex feature patterning.
With laser exposure control down to individual pulses, the IX-255 can set material ablation rates with << 1 μm resolution allowing selective removal of thin surface layers for 3D contouring of parts. The same film removal ablation capabilities are available in the IX-280-ML, a similar platform that can be configured with two different laser types allowing successive different machining functions to be performed in the same system, eliminating a part-handling and alignment process. |
| High beam energy density for broad machining applications |
| Good beam uniformity and beam intensity control for process repeatability |
| UV processing for minimal heat generation in polymers |
| IPG Proprietary UV laser and beam delivery systems |
| Highly accurate 3-axes motion system for precise placement |
| Motion Control Electronics | Up to 8-axes of Servo or Step Motor Control, integrated into single interface for all motorized components as well as the laser fire mechanism |
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X-Y Part Positioning Stage |
Linear Glass Scale Encoders; Linear Motor Servo Drive System |
| X-Y Stage Specifications | Travel: Up to 125 mm Diameter Standard, Optional up to 150 mm Resolution: 0.1 μm Accuracy: ±5 μm over 125 × 125 mm travel Repeatability: <1.0 μm (bidirectional) |
| Z-theta Wafer Alignment Stage | Step Motor Drive System for both Z- and Theta-axes |
| Z-axis Stage Specifications | Travel: 10.0 mm Resolution: 0.25 μm Accuracy: 5.0 μm Repeatability: ±4.0 μm (bidirectional) |
| Theta-axis Stage Specifications | Travel: ±175° Resolution: 0.001° Accuracy: ±0.02° Repeatability: ±0.003° |
| Video Microscope System | MicroTech Camera Assembly OXC Camera for On-target Process Viewing High Magnification Inspection Camera |
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Energy Density |
248 nm Beam Size |
193 nm Beam Size |
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| High Fluence |
25 J/ cm2 |
50 x 100 µm | 40 x 80 µm |
| Medium Fluence | 10 J/ cm2 | 80 x 160 µm | 65 x 130 µm |
| Large Field | 2.0 J/ cm2 | 175 x 350 µm | 140 x 280 µm |
| Extended Field (Homogenizer Option) | 1.5 J/ cm2 | 500 x 500 µm | 400 x 400 µm |
| Extended Field Size |
Beam Homogenizer Providing Controlled Beam Energy Uniformity over Larger Field Size; |
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Programmable Rectangular Variable Aperture |
Enabling Continuously Adjustable Size of Rectangular Shaped Beams |
| Stage Options | Air-bearing X-Y Stage Upgrade, Spindle Stage, Mask Positioner |
| Wavelength Conversion Kits | Laser Wavelength Conversion (Requires IPG Service Engineer Support) |
| Optional Components |
Beam Profilometers, Pulse-to-pulse Energy Monitor, System Logging Capabilities, Power Conditioning Units |
| IX-280-MLIPG’s IX-280-ML is designed for R&D and advanced processing environments where machining versatility and precision are key system requirements. Supporting up to two laser types in a single Class 1 workstation the IX-280-ML comprises part-handling stages, vision systems and control electronics, integrated with either one or two lasers. | ||
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Each laser is equipped with its own beam delivery system appropriate for the application, with options including fixed focused beam, fixed shaped beam, scanning galvanometer and thermal cutting heads. Fiber-delivery and free-space lasers are supported. Laser choices include wavelengths from 193 nm to 1070 nm, and pulse durations from picosecond to long-nanosecond and CW. With multiple beam delivery options appropriate for each type of laser, complementary laser/beam formation configurations can be selected to provide the widest possible combination of machining capabilities within a single workstation. |
| Two independent lasers and beam delivery systems for maximum process flexibility |
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Fiber-delivery and free-space lasers are supported |
| Precision vision and motion systems for accurate machining |
| Powerful and easy to use software supporting broad application mix |
| Fixed beam, Shaped Beam, Scanning Beam and Cutting/Welding head options |
| Process areas up to 300 x 300 mm |
Dimensions
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IX-280-ML, WxD, mm |
1200 x 1000 |
Additional 900 mm (36 in.)
service access required on all sides |
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Laser Rack*, WxD, mm |
810 x 560 |
Locate within 6 m (20 ft.) of the workstation |
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Chiller*, WxD, mm |
50 x 370 |
Locate within 3 m (10 ft.) of laser |
*Typical requirements; external laser rack and chiller may not be required in all cases.
Consult IPG for exact layout details of specific tool configurations.
Utilities
| Electrical Power, Workstation |
208 V (3 phases, neutral, ground) |
5.4 kVA |
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Electrical Power, Fiber Laser |
200-240 V (Single phase) |
14 A |
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Process Gas |
Up to 3 gasses |
2070 kPa (300 psi), 56 l/min. (120 SCFH) |
| BDS Purge Gas (UV Lasers) | Dependent on laser model | |
| Laser Gas (UV MicroX Lasers only) | Nitrogen | |
| Compressed Air | Dry, Filtered <1 μm | 25 kPa (7.5 Hg), 30 l/min. (1 cfm) |
| Vacuum | May be required for part holding | 25 kPa (7.5 Hg), 30 l/min. (1 cfm) |
| Workstation Ventilation | 300-600 l/min (10-20 scfm) | |
| Process Area Ventilation | 300-1200 l/min (10-40 scfm),
5.5 kPa (1.62 in Hg) |
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Laser Configurations
| Cutting Head | Fixed Beam | Galvanometer | ||
| Quasi-CW | Yes | Focused | Shaped | Yes |
| Nanosecond Pulsed | Yes | Yes | Yes | |
| Picosecond Pulsed | Yes | Yes | Yes | |
| UV-MicroX | Yes | |||
Workstation Parameters
| Workstation |
Fully interlocked CDRH Class 1 system including weldment frame, granite latform with beam |
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Work Envelope under Beam Cutting Head: Z-travel: |
X: 300 mm (12 in.) |
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Motion Platform X, Y Stage:
Cutting Head Z-stage: |
Linear Recirculating Ball Slides; Linear Motors and Encoders Resolution: 100 nm Velocity: 750 mm/sec Crossed Roller, Servo Driven Bidirectional Repeatability: Z: ±3.5 μm, Theta ±50 μrad |
| Cutting Head | Focal point cutting and drilling, integrated on-target camera and gas jet assembly with replaceable cover slide; options include lens focal length and nozzle diameter |
| Fixed Objective | Imaging, scribing and focal point processing. Integrated video microscope and inspectioncamera and on-target video camera. Sub-micron imaging objective options |
| Galvanometer |
Focal point processing. 24-bit resolution scanner with on-target video camera. |
| Controls/ Interface | 15 in. touch screen video monitor, full-size keyboard and mouse on workstation mounted ergo arm. Chroma.NET proprietary E95 style graphical user interface and parallel processing software running on quad core processor |
| Process Gas |
Electronically controlled pressure regulator for three process gasses up to 300 psi (2,070 kPa) |
| Stage Enhancements |
High performance X-Y and Z-Theta stages, stage mapping and correction, |
| Galvanometer Temperature Control | Closed-loop galvanometer temperature control for critical accuracy applications |
| UV Fixed Beam Delivery |
Beam homogenizer option providing controlled beam energy uniformity over larger field |
| Alignment Automation |
Functionality for automated part and beam-to-camera alignment, |
| Beam Measurement & Formation |
Power meters, beam profilometry, programmable apertures and attenuators, |
| Light Tower | System status indicator with three light colors; each with off, solid or flashing conditions |
| Power Conditioners |
Range of power conditioning units for voltage regulation and improved immunity to mainsborne |
| Gas Cabinets | Gas delivery systems to maintain quality of ultra high purity laser gasses (UV MicroX only) |
| Die Size Independent LLO |
Selective Material Removal |
| Advanced Laser Lift-off (ALLO) | UV Ablation |
| Thin-film Patterning | |
