The IX-255 UV Ablation Systems are highly versatile multi-application laser micromachining tools used in R&D and advanced processing environments. Available with either 193 nm or 248 nm laser sources, these systems deliver on-part beam energy exceeding 25 J/cm2 to provide machining of glass, metals, polymers and ceramics. User-adjustable controls enable either tightly focused or large area beams which can be used for drilling, cutting or selectively removing surface layers of material for 3-D contouring of parts. A uniform beam profile to support high-resolution imaging of complex shapes is available with the optional beam homogenization module. The same UV machining capabilities are available in the IX-280-ML, a similar platform that can be configured with two different laser types providing maximum material and process versatility in a single machining system.
| High beam energy density for broad machining applications |
| Good beam uniformity and beam intensity control for process repeatability |
| UV processing for minimal heat generation in polymers |
| IPG Proprietary UV laser and beam delivery systems |
| Highly accurate 3-axes motion system for precise placement |
| Motion Control Electronics | Up to 8-axes of Servo or Step Motor Control, integrated into single interface for all motorized components as well as the laser fire mechanism |
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X-Y Part Positioning Stage |
Linear Glass Scale Encoders; Linear Motor Servo Drive System |
| X-Y Stage Specifications | Travel: Up to 125 mm Diameter Standard, Optional up to 150 mm Resolution: 0.1 μm Accuracy: ±5 μm over 125 × 125 mm travel Repeatability: <1.0 μm (bidirectional) |
| Z-theta Wafer Alignment Stage | Step Motor Drive System for both Z- and Theta-axes |
| Z-axis Stage Specifications | Travel: 10.0 mm Resolution: 0.25 μm Accuracy: 5.0 μm Repeatability: ±4.0 μm (bidirectional) |
| Theta-axis Stage Specifications | Travel: ±175° Resolution: 0.001° Accuracy: ±0.02° Repeatability: ±0.003° |
| Video Microscope System | MicroTech Camera Assembly OXC Camera for On-target Process Viewing High Magnification Inspection Camera |
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Energy Density |
248 nm Beam Size |
193 nm Beam Size |
|
| High Fluence |
25 J/ cm2 |
50 x 100 µm | 40 x 80 µm |
| Medium Fluence | 10 J/ cm2 | 80 x 160 µm | 65 x 130 µm |
| Large Field | 2.0 J/ cm2 | 175 x 350 µm | 140 x 280 µm |
| Extended Field (Homogenizer Option) | 1.5 J/ cm2 | 500 x 500 µm | 400 x 400 µm |
| Extended Field Size |
Beam Homogenizer Providing Controlled Beam Energy Uniformity over Larger Field Size; |
|
Programmable Rectangular Variable Aperture |
Enabling Continuously Adjustable Size of Rectangular Shaped Beams |
| Stage Options | Air-bearing X-Y Stage Upgrade, Spindle Stage, Mask Positioner |
| Wavelength Conversion Kits | Laser Wavelength Conversion (Requires IPG Service Engineer Support) |
| Optional Components |
Beam Profilometers, Pulse-to-pulse Energy Monitor, System Logging Capabilities, Power Conditioning Units |