Cutting and Scribing
IPG’s Cutting and Scribing Systems combine world-leading
fiber lasers with beam/part positioning and software,
offering highly productive tools for cutting and scribing
parts made of metals, ceramics, semiconductors,
sapphire, silicone, polymers and many other materials.
Standard IPG systems accommodate part/substrate
sizes from a few millimeters up to 1.2 x 1.2 m.
IPG will optimize selection of laser type and
beam delivery design for each application.
Custom configurations of each tool
are available. User can select
automation options from manual
load to fully-automated platforms
suited for 24/7 production.