IX-255-LLOIX-6600IX-255IX-280-ML

Micro Material Removal

IX-255-LLO, IX-6655, IX-255, IX-280-ML

The Micro Material Removal product range include Laser Lift Off (LLO) and UV Ablation systems. LLO systems utilize the difference in bandgap energy between GaN semiconductor filmstacks and sapphire materials in order to remove the sapphire wafers used in the manufacture of LEDs. UV Ablation systems directly remove conformal coatings and insulation layers, or directly pattern conductive coatings on electrical parts.

 

Both system types provide precise control of the laser beam shape and energy parameters and deliver high beam positioning accuracy. All systems can be configured for manual loading or fully automated production operation.

3D
IX-255-LLOIPG Microsystems’ IX-255-LLO is a highly flexible UV laser micromachining system used by the LED manufacturing industry for the separation of sapphire carriers from the GaN active devices. The IX-255-LLO is a manual load system for wafers up to a maximum diameter of 150 mm.

The system combines a Class 1 workstation integrated with a proprietary UV laser, tool shape selector and software for complex automation sequences. The system can be configured with 193 or 248 nm lasers, and beam delivery configurations are available for high fluence, medium fluence and low fluence process applications. Optional on-target and mask plane beam profilometry can be added for enhanced process QA control.

The same LLO capabilities are available in the IX-280-ML, a similar platform that can be configured with two different laser types allowing successive different machining functions to be performed in the same system, eliminating a part-handling and alignment process.

IX-255-LLO Features

Beam Size Selectable up to 500 × 500 μm
Independent Process and Alignment Cameras for Sub-micron Part Alignment Capability

248 or 193 nm Laser Options Available

High Precision XY Air Bearing Part Handling Stages

Profilometer and Pulse Energy Monitor Options for Extended QA Logging
Motion Control Electronics Up to 8-axes of Servo or Step Motor Control, integrated into single interface for all motorized components as well as the laser fire mechanism

Air-bearing X-Y Part Positioning Stage

Linear Glass Scale Encoders; Linear Motor Servo Drive System

X-Y Stage Specifications

Travel: Up to 125 mm diameter processing area
Resolution: 0.1 μm
Accuracy: ±5 μm over 125 × 125 mm travel
Repeatability: <1 μm (bidirectional)

Z-theta Wafer Alignment Stage Servomotor Drive System for both Z- and Theta-axes
Z-axis Specifications

Travel: 10.0 mm
Resolution: 0.25 μm
Accuracy: ±5.0 μm
Repeatability: <±4.0 μm (bidirectional)

Theta-axis Specifications

Travel: ±175°
Resolution: 0.001°
Accuracy: ±0.02° 
Repeatability: ±0.003°

Video Microscope System

MicroTech Camera Assembly
OXC Camera for On-target Process Viewing
High Magnification Inspection Camera

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Extended Field Size Beam Homogenizer Providing Controlled Beam Energy Uniformity over Larger Field Size; Optimized for >2x system throughput in Lower-fluence Applications

Programmable Rectangular Variable Aperture

Enabling Continuously Adjustable Size of Rectangular Shaped Beams

Stage Options Air-bearing X-Y Stage Upgrade, Spindle Stage, Mask Positioner
Wavelength Conversion Kits Laser Wavelength Conversion (Requires IPG Service Engineer Support)
Optional Components Beam Profilometers, Pulse-to-pulse Energy Monitor, System Logging Capabilities, Power Conditioning Units
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IX-255-LLO Datasheet

IX-6600 The IX-6655-LLO is optimized for Laser Lift-Off (LLO) processes that are independent of die size, with additional capability for multi-purpose UV laser micromachining. The system combines a Class-1 workstation with an externally mounted laser, select grade homogenizer optics to provide uniform beam size adjustable to 500 x 500 μm, dual beam profilometry, pulse-to-pulse energy monitor with data logging and wafer map.

The IX-6655-LLO is designed for demanding 24/7 high volume production applications.

Featuring optional automation with cassette load/unload ports, robotics, wafer pre-aligner, and machine vision the system is capable of multiple wafer sizes up to 200 mm. The laser system provides high throughput with the lowest Cost Of Ownership resulting from extended lifetimes and cleaning intervals.

The same LLO capabilities are available in the IX-280-ML, a similar platform that can be configured with two different laser types allowing successive different machining functions to be performed in the same system, eliminating a part-handling and alignment process.

IX-6555-LLO Features

Beam Size Selectable up to 500 × 500 μm
Independent Process and Alignment Cameras for Sub-micron Part Alignment Capability

248 or 193 nm Laser Options Available

High Precision XY Air Bearing Part Handling Stages

Profilometer and Pulse Energy Monitor Options for Extended QA Logging
Optional Robotic Wafer Loader for Fully Automated Operation
Frame and Enclosure Fully enclosed Class 1 laser system, heavy duty weldment frame with integrated beam delivery system and control electronics in a 1.7 m x 2 m footprint with an externally mounted laser (included in foot print).

Beam Delivery System

All Granite Beam Delivery Support Structure; Vibration isolating mounting platform for wafer stages and beam delivery optics; Siffness and large thermal mass of granite structure prevent changes in beam delivery system alignment over time; Pnuematic, 2 position laser beam stop; Precision optic mounts for stability and ease of adjustment; select grade UV Homogenizer optics.

Motion Control Electronics Up to 12-axes of Servo or Step Motor Control, integrated into a single interface for all motorized components as well as the laser fire mechanism

Part Handling

X-Y Stage Specifications Travel: Up to 200 mm diameter processing area Optional Stages: Compatible up to 300mm wafer processing Resolution: 0.1 µm Accuracy: <3 µm over 125 mm x 125 mm area Repeatability: <1 µm (bidirectional)
Z-axis Specifications Travel: 10 mm Resolution: 0.25 µm Accuracy: 5.0 µm Repeatability: 1.5 µm (bidirectional)

Theta-axis Specifications

Travel: ±175 ° Resolution: 3.6 µrad Accuracy: 300 µrad overall. 25 µrad/per ° Repeatabiility: ±5.0 µrad

Programmable Rectangular Variable Aperture Enabling continuously adjustable size of rectangular shaped beam. Standard Openining: 0-15mm

Vision System and Alignment

Dual Camera MicroTech Vision System with 8.3 and 0.12 µm/pixel process and inspection cameras

Programmable Illumination

Programmable lighting intensity control for automated optimization of imaging and alignment

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 Optional Equipment

Automated Cassette Load/Unload System Sapphire Picker
Wafer Pre-aligner Features Vision System Dual Beam Profilometry
Database Connectivity Software On-Target Power Meter
Laser Calibration Power Meter/Beam Stop Pulse Energy Monitor
Debris Management System Motorized Mask Changer
Lathe Stage
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IX-6655 Laser Lift-Off System Datasheet

IX-255The IX-255 is a versatile multi-application laser micromachining tool used for selective material removal, patterning and machining.
Available with either 193 nm or 248 nm laser sources, these systems deliver on-part beam energy exceeding 25 J/cm2 to provide machining of glass, metals, polymers and ceramics. User-definable beam sizes up to 500 μm, with uniform energy density profiles can be used for large-area material removal or complex feature patterning.

With laser exposure control down to individual pulses, the IX-255 can set material ablation rates with << 1 μm resolution allowing selective removal of thin surface layers for 3D contouring of parts.

The same film removal ablation capabilities are available in the IX-280-ML, a similar platform that can be configured with two different laser types allowing successive different machining functions to be performed in the same system, eliminating a part-handling and alignment process.

IX-255 Features

High beam energy density for broad machining applications
Good beam uniformity and beam intensity control for process repeatability
UV processing for minimal heat generation in polymers
IPG Proprietary UV laser and beam delivery systems
Highly accurate 3-axes motion system for precise placement
Motion Control Electronics  Up to 8-axes of Servo or Step Motor Control, integrated into
 single interface for all motorized components as well as the laser fire mechanism

X-Y Part Positioning Stage

 Linear Glass Scale Encoders; Linear Motor Servo Drive System
X-Y Stage Specifications  Travel: Up to 125 mm Diameter Standard, Optional up to 150 mm
 Resolution: 0.1 μm
 Accuracy: ±5 μm over 125 × 125 mm travel
 Repeatability: <1.0 μm (bidirectional)
Z-theta Wafer Alignment Stage  Step Motor Drive System for both Z- and Theta-axes
Z-axis Stage Specifications  Travel: 10.0 mm
 Resolution: 0.25 μm
 Accuracy: 5.0 μm 
 Repeatability: ±4.0 μm (bidirectional)
Theta-axis Stage Specifications  Travel: ±175°
 Resolution: 0.001°
 Accuracy: ±0.02°
 Repeatability: ±0.003°
Video Microscope System   MicroTech Camera Assembly
 OXC Camera for On-target Process Viewing
 High Magnification Inspection Camera
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 Energy Density

248 nm Beam Size

193 nm Beam Size

High Fluence

25 J/ cm2

50 x 100 µm 40 x 80 µm
Medium Fluence 10 J/ cm2 80 x 160 µm 65 x 130 µm
Large Field 2.0 J/ cm2  175 x 350 µm  140 x 280 µm
Extended Field (Homogenizer Option) 1.5 J/ cm2 500 x 500 µm 400 x 400 µm
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Extended Field Size 

Beam Homogenizer Providing Controlled Beam Energy Uniformity over Larger Field Size;
Optimized for >2x system throughput in Lower-fluence Applications

Programmable Rectangular Variable Aperture

Enabling Continuously Adjustable Size of Rectangular Shaped Beams
Stage Options Air-bearing X-Y Stage Upgrade, Spindle Stage, Mask Positioner
Wavelength Conversion Kits Laser Wavelength Conversion (Requires IPG Service Engineer Support)
Optional Components

Beam Profilometers, Pulse-to-pulse Energy Monitor, System Logging Capabilities, Power Conditioning Units

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IX-255 Datasheet

IX-280-MLIPG’s IX-280-ML is designed for R&D and advanced processing environments where machining versatility and precision are key system requirements. Supporting up to two laser types in a single Class 1 workstation the IX-280-ML comprises part-handling stages, vision systems and control electronics, integrated with either one or two lasers.

Each laser is equipped with its own beam delivery system appropriate for the application, with options including fixed focused beam, fixed shaped beam, scanning galvanometer and thermal cutting heads. Fiber-delivery and free-space lasers are supported.

Laser choices include wavelengths from 193 nm to 1070 nm, and pulse durations from picosecond to long-nanosecond and CW. With multiple beam delivery options appropriate for each type of laser, complementary laser/beam formation configurations can be selected to provide the widest possible combination of machining capabilities within a single workstation.

IX-280-ML Features

Two independent lasers and beam delivery systems for maximum process flexibility

Fiber-delivery and free-space lasers are supported

Precision vision and motion systems for accurate machining
Powerful and easy to use software supporting broad application mix
Fixed beam, Shaped Beam, Scanning Beam and Cutting/Welding head options
Process areas up to 300 x 300 mm

Dimensions

IX-280-ML, WxD, mm
inches

1200 x 1000
49 x 40

Additional 900 mm (36 in.)

service access required on all sides

Laser Rack*, WxD, mm
inches

810 x 560
32 x 22

Locate within 6 m (20 ft.) of the workstation

Chiller*, WxD, mm
inches

50 x 370
20 x 15

Locate within 3 m (10 ft.) of laser

*Typical requirements; external laser rack and chiller may not be required in all cases.
Consult IPG for exact layout details of specific tool configurations.

Utilities

Electrical Power, Workstation

208 V (3 phases, neutral, ground)

5.4 kVA

Electrical Power, Fiber Laser

200-240 V (Single phase)

14 A

Process Gas

Up to 3 gasses

2070 kPa (300 psi), 56 l/min. (120 SCFH)

BDS Purge Gas (UV Lasers) Dependent on laser model  
Laser Gas (UV MicroX Lasers only) Nitrogen 
Compressed Air Dry, Filtered <1 μm 25 kPa (7.5 Hg), 30 l/min. (1 cfm)
Vacuum May be required for part holding 25 kPa (7.5 Hg), 30 l/min. (1 cfm)
Workstation Ventilation 300-600 l/min (10-20 scfm)
Process Area Ventilation 300-1200 l/min (10-40 scfm),

5.5 kPa (1.62 in Hg)

Laser Configurations

  Cutting Head Fixed Beam  Galvanometer
Quasi-CW Yes Focused Shaped Yes
Nanosecond Pulsed   Yes Yes Yes
Picosecond Pulsed   Yes Yes Yes
UV-MicroX     Yes  

Workstation Parameters

Workstation

Fully interlocked CDRH Class 1 system including weldment frame, granite latform with beam
delivery support, control electronics, pneumatics & motion and beam delivery systems

Work Envelope under Beam

Cutting Head:
Fixed Beam:
Galvanometer:

Z-travel:

 

X: 300 mm (12 in.)
X: 300 mm (12 in.) Y: 300 mm (12 in.)
X: 300 mm (12 in.) Y: 300 mm (12 in.) with part rotation
X: 195 mm (7.6 in.) Y: 300 mm (12 in.) no part rotation
100 mm (4 in.)

Motion Platform

X, Y Stage:

 

 


Z-theta Stage:

 

Cutting Head Z-stage:

 

Linear Recirculating Ball Slides; Linear Motors and Encoders

Resolution: 100 nm Velocity: 750 mm/sec
Accuracy: ≤ ±5 μm Full Travel (≤ ±2 μm Optional)
Bidirectional Repeatability: 0.9 μm

Crossed Roller, Servo Driven
Resolution: Z: 500 nm, Theta 17.5 μrad
Travel: 10 mm
Accuracy: Z: 7 μm, Theta 500 μrad Full Travel

Bidirectional Repeatability: Z: ±3.5 μm, Theta ±50 μrad
Travel: 100 mm
Velocity: 12 mm/sec
Accuracy: 8 μm
Repeatability: ±3 μm

Cutting Head Focal point cutting and drilling, integrated on-target camera and gas jet assembly with replaceable cover slide; options include lens focal length and nozzle diameter
Fixed Objective Imaging, scribing and focal point processing. Integrated video microscope and inspectioncamera and on-target video camera. Sub-micron imaging objective options
Galvanometer

Focal point processing. 24-bit resolution scanner with on-target video camera.
100 mm focal length lens supplied as standard (approx. 60x60 mm deflection field)
Max F-theta working distance 500 mm. Other lenses available upon request.

Controls/ Interface 15 in. touch screen video monitor, full-size keyboard and mouse on workstation mounted ergo arm. Chroma.NET proprietary E95 style graphical user interface and parallel processing software running on quad core processor
Process Gas

Electronically controlled pressure regulator for three process gasses up to 300 psi (2,070 kPa)
Third process gas control option.

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Stage Enhancements

High performance X-Y and Z-Theta stages, stage mapping and correction,
lathe stage for parts up to 10 mm dia and custom-designed part holders

Galvanometer Temperature Control Closed-loop galvanometer temperature control for critical accuracy applications
UV Fixed Beam Delivery

Beam homogenizer option providing controlled beam energy uniformity over larger field
size, “line beam” for high-speed scribing, custom imaging designs

Alignment Automation

Functionality for automated part and beam-to-camera alignment,
automated vision illumination control and in-process positional adjustment

Beam Measurement & Formation

Power meters, beam profilometry, programmable apertures and attenuators,
pulse-to-pulse energy monitoring and data logging

Light Tower System status indicator with three light colors; each with off, solid or flashing conditions
Power Conditioners

Range of power conditioning units for voltage regulation and improved immunity to mainsborne
interference

Gas Cabinets Gas delivery systems to maintain quality of ultra high purity laser gasses (UV MicroX only)
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IX-280-ML Datasheet

Applications

Die Size Independent LLO

Selective Material Removal

Advanced Laser Lift-off (ALLO) UV Ablation 
Thin-film Patterning
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