Selective Material Removal
Selective material removal refers to using lasers to remove only
one type or area of a material from a complex part, while
leaving the remainder undamaged. Selectivity can be
achieved by energy-dependent depth control, wavelength-
dependent material interactions and spatial selectivity.
Micro Material Removal products include Laser Lift Off
systems used in the LED manufacturing industry for
sapphire wafer separation, and UV ablation tools
used for microelectronic circuit patterning.
Ablative coating removal refers to fully automated
higher power systems used for paint stripping,
rust removal, mold cleaning and pre-weld
surface reparation and cleaning.