IX-210-MDIX-280-CIX-280-FIX-6168-CIX-3000

Micro Cutting and Scribing

IPG designs and manufactures laser systems for micro cutting and scribing of products in the microelectronics, MEMS, semiconductor, LED, biomedical devices, and photovoltaic industries.

The fully-integrated Class 1 systems combine precision part-moving stages, high-resolution alignment systems and application-optimized lasers with IPG’s proprietary control software to provide both high-throughput and micron-level cutting accuracies.

The Micro Cutter product range covers semiconductor materials, metals, ceramics and polymers. Each product has laser and beam delivery design optimized for a specific application and can be configured for manual through fully-automatic operation, allowing customers to buy exactly the application solution they need.

3D
IX-210-MD

The Metal Wafer Cutting laser systems are used by LED manufacturing industry for singulation of metal wafers. Substrates are typically copper moly or alloy up to 150 µm thick, and the primary requirements are accuracy of cut position within the streets and low heat affected zone.

Within this product group, the IX-210-MD is a manual load system for wafers up to 150 mm diameter, while the IX-6100-MD can take wafers up to 200 mm, and can be fully automated by the addition of the optional Integrated Automation Platform (IAP).

IX-MD Features

IPG's Proprietary Line-beam Formation to Maximize Throughput, Minimize Heat Affected Zone and Weld-back
Short Wavelength High Pulse Energy Laser for Efficient and Fast Cutting
Highly Accurate 3-axes Motion System for Precise Scribe Placement within Streets
Advanced Vision and Illumination System and Distortion Compensation for Increased Cut Placement Accuracy
Fully Programmable with Automated Part Handling Options for 24/7 Unattended Operation
  IX-210-MD IX-6100-MD
Frame and Enclosure

Fully enclosed Class I laser system
Heavy duty weldment frame integrates laser, beam delivery system and control electronics into a single workstation
Includes casters and leveling feet with vibration isolation pads

Footprint, W × D, m 1.0 × 1.2 1.0 × 1.9

Wavelengths, nm

266, 355, 532, 1064
Beam Delivery System for Wafer Dicing

All granite beam delivery support structure
Patented optical beam delivery configuration for ultra narrow scribing kerf
Vibration isolating mounting platform for wafer stages and beam delivery optics
Stiffness and large thermal mass of granite structure prevent changes in beam delivery system alignment over time
Pneumatic, 2 position Laser Beam Stop
Precision optic mounts for stability and ease of adjustment; Select grade UV optics
Cut widths down to 2.5 μm with patented high resolution optics

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  IX-210-MD IX-6100-MD
Motion Control Electronics Up to 12-axes of Servo or Step Motor Control, integrated into
single interface for all motorized components as well as the laser fire mechanism

Air-bearing X-Y Part Positioning Stage

Linear Glass Scale Encoders; Linear Motor Servo Drive System

X-Y Stage Specifications Up to 150 mm diameter processing area
Up to 200 mm diameter processing area
Resolution: 0.1 μm
Accuracy: ±3 μm over 150 mm travel
Repeatability: <1 μm (bidirectional)
Z-theta Wafer Alignment Stage Servomotor Drive System for both Z- and Theta-axes
Z-axis Stage Specifications Travel: 10.0 mm
Resolution: 0.25 μm
Accuracy: 5.0 μm 
Repeatability: 1.5 μm (bidirectional)
Theta-axis Stage Specifications  Travel: ±175°
Resolution: 3.6 μrad
Accuracy: 300 μrad overall. 25 μrad/° 
Repeatability: ±5.0 μrad
Video Microscope System  MicroTech Camera Assembly
OXC Camera for On-target Process Viewing
High Magnification Inspection Camera
Loading Automation Not Available

Fully automated loading with Integrated Automation Platform (IAP) option

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IX-210 DatasheetIX-6100 Datasheet

IX-280-C

The IX-280-C system is designed for cutting, scribing and drilling of ceramics and other materials used in microelectronics and specialized semiconductor packaging applications. With capabilities for scribing 380 µm alumina at rates up to 300mm/sec, and cutting at 250mm/sec, while supporting via drilling rates up to 3,000 holes/sec in 100 µm alumina, the IX-280-C provides high-speed processing of sub-100 µm features parts that are challenging for traditional laser processing tools. The IX-280-C platform can be configured with two different laser types, allowing successive different machining functions to be performed in the same system, eliminating a part-handling and alignment process.

IV-280-C is a Class 1 laser system with integrated laser, heavy duty weldment frame, all-granite vibration isolation platform and beam delivery support structure in a 1000 × 1220 mm footprint.

IX-280-C Features

Scribing rates up to 300 mm/s for 380 μm alumina
Cutting rates up to 250 mm/s
Drilling rates exceeding 3,000 holes/sec for 100 µm alumina
Hole sizes down to 15 µm in 380 µm alumina
Precision vision and motion systems for accurate machining 
Powerful and easy to use software supporting broad application mix
Up to two lasers for process flexibility and elimination of part handling time
Process areas up to 300 x 300 mm
Laser 1070 nm QCW, power selectable at time of order; typically 150/1500 W or 300/3000 W
Beam Delivery FLC-D30 Cutting Head or FLC Micro Cutting Head

Part Handling

Motion Control Electronics Additional 4- or 8-axes of motion, required for some options
X-Y Stage Specifications

300 mm x 330 mm; Accuracy: ±5 μm over 125 μm travel
(±3 μm Optional); Repeatability: <1.0 μm

Z-theta Adjust Choice of standard or high performance manual or motorized Z-theta stages
Lathe Stage (Optional) Rotary stage for round parts up to 10 mm diameter; mounts to standard X-Y stage

Beam Formation and Scanning

Beam Delivery Fiber delivery to cutting head
Laser Optics Beam demagnification or expansion optics to support target application
Thermal Cutting/ Weld Head Integrated gas jet assembly, two process gasses supported, options include lens focal lengths and nozzle diameters

Beam Characterization

Power Meter On-target power meter and data logging enables programmable measurement and adjustment

Vision System and Alignment

Dual Camera System MicroTech vision system with 8.3 and 0.12 μm/ pixel process and inspection resolution
Programmable Illumination Programmable control of lighting intensity for automated optimization of imaging and alignment
Alignment Options for automated part, beam-camera alignment and in-process positional adjustment
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IX-280-C Datasheet

IX-280-F

The IX-280-F workstation is designed for singulating sapphire display covers and downsizing silicon and other semiconductor wafers either to fit into available processing tools, or for segmenting into individual large-area elements.

The high energy laser source enables high-speed cutting, with precision vison and motion systems ensuring accurate cut placement.

The IX-280-F system is optimized for cutting thicker substrate materials, and is not suitable for singulation of typical VLSI devices.

IX-280-F Features

Substrate Thickness from 50 microns to 3 mm

Downsizing of Silicon, Sapphire and GaAs Wafers

300 mm x 300 mm Processing Area

High-speed Cutting of Silicon, Ceramics and Sapphire

Polished and Up-polished Substrate Compatibility

Compatible with Wide Range of IPG's Fiber Delivery Lasers
Precision vision and motion systems for accurate machining 
Powerful and easy to use software supporting broad application mix
Base Platform Class 1 laser system with integrated laser, heavy duty weldment frame, all-granite vibration isolation platform and beam delivery support structure in a 960 mm x 1220 mm footprint

Base Delivery System

Laser operating at 1064 nm; 3-axis motion (including laser fire) control system; single camera, Z-axis manual controls, fiber laser beam forming optics and demag or expansion optics, precision X-Y stage for 300 mm x 300 mm diameter parts; LED part illumination with dimmer control and standard chuck and debris extraction

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Part Handling

Motion Control Electronics

Additional 4- or 8-axes of motion, required for some options

X-Y Stage Specifications

300 mm x 330 mm; Accuracy: ±5 μm over 125 μm travel
(±3 μm Optional); Repeatability: <1.0 μm

Z-theta Adjust Choice of standard or high performance manual or motorized Z-theta stages
Lathe Stage (Optional) Rotary stage for round parts up to 10 mm diameter; mounts to standard X-Y stage
IAP (Optional) Automated part handling for uninterrupted production

Beam Formation and Scanning

Beam Delivery

Fiber delivery to cutting head

Laser Optics

Beam demagnification or expansion optics to support target application

Thermal Cutting/ Weld Head Integrated gas jet assembly, two process gasses supported, options include lens focal lengths and nozzle diameters

Beam Characterization

Power Meter On-target power meter and data logging enables programmable measurement and adjustment
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Process Quality and Speed

Sapphire Thickness

Typical Cutting Speed

0.4 mm

10-14 mm/s

1.0 mm 8-10 mm/s
3.0 mm 3-8 mm/s
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IX-280-F Datasheet

IX-6168-C

The IX-6168-C platform is designed for singulation of specialized ceramic parts, most typically found in the specialty semiconductor or LED manufacturing applications.

Incorporating high-speed imaging alignment and a step and scan architecture, the IX-6168-C platform provides singulation of non-rectangular components for unattended production applications.

Because many specialized substrate materials have unique material-laser interaction characteristics, IPG offers tool optimization programs for the IX-6168-C platform to maximize customer productivity and component yield.

IX-6168-C Features

High-precision large-area step and scan architecture for high throughput
Tool/material optimization programs available
 
High-cut quality and small heat affected zone for minimum affect on device performance
Manual load or fully-automated systems with purchase of the optional Integrated Automation Platform (IAP)
Frame and Enclosure

All Granite Beam Delivery Support Structure
Fully enclosed Class I laser system, heavy duty weldment frame integrates laser, beam
delivery system and control electronics into a single 1 M x 1.9 M footprint; includes
casters and leveling feet with vibration isolation pads

Laser Ultrafast laser selection based on application requirements
Fixed Beam Delivery System

Vibration Damped Advanced Design System
Vibration isolating mounting platform for wafer stages and beam delivery optics;
Stiffness and large thermal mass of granite structure prevent changes in beam delivery
system alignment over time

Galvanometer for High Speed Scanning

Selection of analog and digital 2D high performance scanner; F-Theta Objective 100 mm
focal length standard; alt. FOV available upon request; Fully integrated control software

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Motion Control Electronics

8-axes of Servo or Step Motor Control, integrated into single interface for all
motorized components

Air-bearing X-Y Part Positioning Stage Linear Glass Scale Encoders; Linear Motor Servo Drive System
X-Y Stage Specifications

Travel: Up to 200 mm diameter processing area
Optional Stages: Compatible up to 300 mm wafer processing
Resolution: 0.1 μm
Accuracy: <±3 μm over 150 mm x 150 mm area
Repeatability: <1 μm (bidirectional)
Stage Speed: 300 mm/ sec (maximum)
High Precision Z-theta Wafer Alignment Stage: Motorized Z-theta System

Video Microscope System

Microtech Camera Assembly
OXC Camera for On-target Process Viewing
High Magnification Inspection Camera

Optional Equipment**

Automated Cassette Load/ Unload System
Wafer Pre-aligner Features Vision System with Automatic Part Alignment
Database Connectivity Software
On-target Power Meter; Laser Calibration Power Meter/ Beam Stop
Debris Management System
** Please discuss with your sales representative for more details

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IX-6168-C Datasheet

IX-3000

The IX-3000 systems are used for cutting, patterning and micro-via drilling, of thin films used in microfluidic devices and sensors for the biomedical sensor and ink-jet printing industries.

Designed for large-area high-resolution processing using economical optics, the system is optimized for high-speed production operation leading to lowest cost-per-part processing.

Frequently supplied as an automated reel-to-reel processing station, the IX-3000 can also be configured with cassette-to-cassette or robotic loading options for other format parts.

IX-3000 Features

High-resolution UV Processing  for Minimal Heat Generation in Polymers
Proprietary Large-field Beam Delivery for High Throughput
Highly Accurate 3-axes Motion System for Precise Placement
Tape and Reel Handling and Automated Feature Alignment for Unattended Operation
Frame and Enclosure Fully enclosed Class 1 laser system, heavy duty weldment frame integrates laser, beam delivery system and control electronics into a single 2.5 m x 3.25 m footprint with an internally mounted laser, up to  6.29 m x 3.25 m externally mounted laser high pulse energy UV laser configurations (included in footprint) 

Available Wavelengths, nm

High Pulse Energy UV Lasers: 193 or 248; Fiber Lasers: 355, 532, 1070 or 1550

Beam Delivery System for Wafer Dicing All Granite Beam Delivery Support Structure
Vibration isolating mounting platform for part handling stages and beam delivery optics;
Stiffness and large thermal mass of granite structure prevent changes in beam delivery system alignment over time; Pneumatic, 2 position Laser Beam Stop; Precision optic mounts for stability and ease of adjustment; Select grade UV optics; available Components include Variable Attenuator, Mask Changers, Rectangular Variable Apertures- manual or motorized, Homogenizers
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Motion Control Electronics Up to 12-axes of Servo or Step Motor Control, Integrates into a 
Single Interface for all Motorized Components as well as the Laser Fire Mechanism

Air-bearing X-Y Part Positioning Stage

Linear Glass Scale Encoders; Linear Motor Servo Drive System
X-Y Stage Specifications Travel: 250 mm (X) x 200 mm (Y) Processing Area (Note: Y-axis travel may be limited for certain material handling applications)
Optional Stages: 400 mm x 400 mm Travel
Resolution: 0.1 μm
Accuracy: ±3 μm over 150 mm travel
Repeatability: <1 μm (bidirectional)
Air-bearing Mask Changer X-Y Positioning Stage Travel: 150 mm (X) x 150 mm (Y) Processing Area; Larger travel stages available upon request. Includes Manual (motorized, optional) Rotational Adjuster, Mask Cassette and Mask Alignment CCD Camera
Video Microscope System

MicroTech Camera Assembly
OXC Camera for On-target Process Viewing
High Magnification Inspection Camera
Optional Film Edge Detection Cameras, Optional Mask Alignment Camera

Optional Equipment** Database Connectivity Software; Dual Beam Profilometry
Debris Management System
Nitrogen Purging of Tape and Reel Module and Humidity Monitoring Systems
** Please discuss with your sales representative for more details
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IX-3000 Datasheet

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