Ultrafine Marking

Ultrafine marking applications are used in

manufacturing for identification, part numbering

and serialization ranging from alphanumeric

to bar codes and data matrix /QR Codes.

 

Considerations when establishing a laser

marking process are laser wavelength

and pulse characteristics for appropriate

contrast in the application, and

whether the feature is machined

into the surface or a more

secure sub-surface

patterning is used.

Novel materials and requirements for ultra small marking challenge traditional laser technology where concerns at the micro-scale include quality of the mark to ensure a high level of readability.

IPG’s technology is well suited for processing difficult to mark materials including polymers, transparent materials such as glass and diamond as well as semiconductor device materials including silicon and epoxy mold compounds. In these materials, data codes as small as 50 × 50 µm can be readily processed with very high feature quality.

 

IPG’s advanced laser processing workstations are available in configurations optimized for high precision micro-marking. For manufacturing operations where marking or serialization is required at the same time as another micromachining step, the Dual Laser System equipped with a Laser Marking Module or other laser and scanning combination can be a highly efficient solution.


Micro Data Matrix Codes

2D Data Matrix Codes as small as 300 × 300 µm can be marked in numerous materials rapidly with IPG advanced laser process technology.  It allows identification and serialization for traceability and counterfeit protection.

Lasers: UV ns  pulsed lasers, green ns pulsed lasers, 150 picosecond lasers, 3-10 picosecond lasers

  copper

Die Serialization

Equipment integrated with wafer handling and automated vision systems can be used for die serialization in the semiconductor industry. UV and short pulse duration lasers allow compatibility with most materials used in backend semiconductor packaging applications. Shown here is alpha numeric marking of 1mm x 1mm die on wafer.

Lasers: UV ns  pulsed lasers, green ns pulsed lasers, 150 picosecond lasers, 3-10 picosecond lasers

  die 2

Glass Marking

High precision glass marking with line widths <10 µm are generated with minimum debris.  High resolution optical systems and short wavelength process avoid micro-cracking while creating a permanent mark that is impervious to chemical cleaning.

Figure shows an alignment reticle on research grade ultra clear glass.

Lasers: UV ns  pulsed lasers, 3-10 picosecond lasers

  reticle

Sub-surface Glass Marking

Allowing a truly debris-free glass mark – subsurface marking in highly transparent materials eliminates concerns regarding debris generation for demanding applications.

Lasers: UV ns  pulsed lasers, green ns pulsed lasers, 3-10 picosecond lasers

 

  subsurface

High Speed Marking

A direct write approach works for high speed scanning over large areas for a variety of transparent materials. The system utilizes galvanometer scanning or the Laser Marking Module  for a truly high-throughput laser marking process.

Lasers: UV ns  pulsed lasers, green ns pulsed lasers, 150 picosecond lasers, 3-10 picosecond lasers

  marking 4
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